Salary and benefits: double weekend paid annual leave

Position label: power semiconductor package design

Position function: semiconductor technology

Job description:

1. Job description:

1) coordinate and expand the market and application support of power module;

2) coordinate the OEM packaging of IGBT/FRD and other single-pipe products.

3) process integration and optimization with IGBT/FRD and other single-pipe OEM;

4) assist in the design of IGBT/FRD and other single pipe and module, and cooperate with the market department to complete product planning and design;

2. Job requirements:

1) bachelor degree or above, majored in electronic engineering, physics, automatic control, materials or related majors;

2) more than one year's relevant experience in IGBT/FRD power module packaging and application, marketing, design, process, etc.;

3) practical experience in front-line semiconductor testing and data analysis;

4) familiar with power module application characteristics and module failure analysis methods;

5) self-motivated, strong sense of responsibility and teamwork spirit;